Modeling and thermal analysis of heat sink layers of multilayer board

  • Kamil Z. Khairnasov Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia
Keywords: Conduction, convection, finite element method, layers heat removal, PCB layers.


Issues of heat dissipation in multilayer printed circuit boards (PCB) are very important due to the increasing density of installation of electronic components. There are many approaches to solving the problem of reducing the temperature of electronic components from conductive and convective heat removal in vacuum and normal operating conditions prior to the use of fans and cooling radiators. In multilayer printed circuit boards, the most efficient is the removal of heat using heat-removing layers made of materials with a high degree of heat transfer: copper, aluminium, magnesium, etc., and of sufficient thickness for efficient heat dissipation. At the same time, as experience shows, an unjustified increase in the thickness of the heat-removing layers in multilayer printed circuit boards leads to a deterioration in the weight characteristics of multilayer boards with an inefficient heat sink. Therefore, the study of the effective thickness of the heat-removing layers and the materials used in this process is an important and urgent problem. Mathematical modelling of the module of an aircraft instrument containing a multilayer printed circuit board with heat-removing layers of various materials has been carried out. The convergence of the calculation results is checked by reducing the mesh of the finite element mesh. Heat removal was taken into account at different thicknesses of the heat-removing layer. The dependence of the heat sink on the thickness of the heat sink layer of the multilayer printed circuit board was revealed. This dependence was nonlinear in nature: with an increase in the thickness of the heat sink layer, the relative value of the heat sink decreased. As a result, the optimum thickness of the heat sink layer was obtained, at which an increase in thickness slightly affected the heat removal.


Download data is not yet available.

Author Biography

Kamil Z. Khairnasov, Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia

PhD of Technical sciences, Associate Professor, Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia


Costa R.L., Vlassov V., (2013). Evaluation of Inherent Uncertainties of the homogeneous Effective thermal Conductivity Approach in Modeling of Printed Circuit boards for Space Applications. Journal of Electronics Cooling and Thermal Control. 3, 35-41.

Dede E., Nomura T., Lee J. (2015). Design of anithotrupic thermal conductivity in multilayer printed circuit boards. IEEE Transactions on Components, Packaging, and Manufacturing Technology Institute of Electrical and Electronics Engineers. 5(12), 1763-1774.

Funk J.N., Mengüç M.P., Tagavi K., Cremers C.J., (1992). Semi-Analytical Method to Predict Printed Circuit Board Package Temperature. IEEE Transaction on components, hybrids and manufacturing technology. 15(5), 675-684.

Khairnasov K.Z. (2013). Modeling and thermal analysis of electronic devices of spacecraft. Bulletin of Moscow Aviation Institute. 3, 56-61.

Levashkin D., Ogin P., Vasilyev F.V. (2019). Efficiency of hybrid cyclic processing with the use of additive technologies on CNC machines for the manufacture of composite aviation parts due to the reduction of processing errors. International Russian Conference on Materials Science and Metallurgical Technology, Vladivostok, Russia. 946, 959-965.

Monier-Vinard E., Laraqi N., Dia C.T., Nguyen M.N., Bissuel V. (2013). Analytical Thermal Modeling of Multi-Layered Active Embedded Chips into High Density Electronic Board. Thermal Science. 17(3), 695-706.

Muzychka Y.S., Bagnall K. R., Wang E. N. (2013). Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance. IEEE Transactions on Components, Packaging and Manufacturing Technology. 3(11), 1826-1841.

Muzychka Y.S., Yovanovich M.M., Culham J.R., (2006). Influence of Geometry and Edge Cooling on Thermal Spreading Resistance. Journal of Thermophysics and Heat Transfer, 20(2), 247-255.

Rinaldi N. (2006). Generalized Image Method with Application to the Thermal Modeling of Power Devices and Circuits, IEEE Transactions on Electron Devices, 49(4), 679-686.

Schacht R., Wunderle B., May D., Michel B., Reichl H. (2008). Modeling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards. Thermal and Thermo-mechanical Phenomena in Electronic Systems Conference, 441-449.

Shabany Y. (2002). Component size and effective thermal conductivity of Printed Circuit Board. Inter Society Conference on Thermal Phenomena, 13.

Vantsov S., Vasilyev F., Medvedev A., Khomutskaya O. (2019). Epoxy-glass composite materials for substrate printed circuit boards gigabit electronics. Amazonia Investiga, 8(22), 434-442.

Vintrou S., Laraqi N., Baïri A., (2012). Calculation and analysis of thermal impedance of microelectronic structures from analytical models. Solid-State Electronics. 67, 45-52.
How to Cite
Khairnasov, K. (2019). Modeling and thermal analysis of heat sink layers of multilayer board. Amazonia Investiga, 8(23), 664-670. Retrieved from
Bookmark and Share